On September 8, ASE Technology rose 3.76% in pre-market trading, trading at $38.78/share, with turnover of $192,500. The broader semiconductor sector also showed strength, with Intel up 2.37% and Micron Technology up 0.67%.

On the news front, ASE Technology is benefiting from Google significantly increasing AI capital expenditure, with TPU production volumes expanding and substantial advanced packaging and testing orders being placed. Market estimates suggest Google TPU shipments will enter a mass volume phase by 2028, with projected output reaching 12 million to 15 million units. Concurrently, Intel is accelerating its EMIB advanced packaging platform and expanding outsourced orders to ASE Technology. Major cloud players including Meta and Google have successively adopted EMIB and EMIB-T platforms.

ASE Technology commands key capabilities in 2.5D and 3D advanced packaging as well as high-end testing. As AI chip testing times lengthen and equipment, material, and labor costs climb, high-end packaging and testing capacity has grown increasingly tight. Previous price hikes of approximately 5% to 10% on advanced packaging services are now feeding through to revenue. COO Tien Wu noted that Intel EMIB and TSMC CoWoS are not in zero-sum competition, suggesting a broadening addressable market for outsourced assembly and test services.

(The above content is based on publicly available market information, generated by a program or algorithm, and is intended solely as a stock movement alert. It does not constitute investment advice or a basis for trading decisions.)