On September 8, ASML Holding NV rose 3.08% in pre-market trading, trading at approximately $1,767.69 per share, with turnover of $37.89 million. The surge was driven by confirmation that both TSMC and Samsung Electronics will adopt ASML's next-generation High Numerical Aperture (High NA) Extreme Ultraviolet lithography systems, priced at up to $400 million per unit.

Specifically, Samsung plans to deploy High NA EUV technology in high-volume DRAM production by 2028, while TSMC intends to begin volume production using current 6-inch reticle-based High NA systems starting in 2030. With these commitments, all three major chipmakers — Samsung, TSMC, and Intel — are now confirmed customers of ASML's most advanced lithography equipment. Samsung will also join an industry initiative to develop 12-inch photomasks for High NA systems, potentially improving production efficiency and reducing costs.

ASML further disclosed that overall EUV equipment capacity is expected to increase approximately 30% by 2027. Looking ahead, ASML plans to demonstrate a pilot production line using larger-format reticles by 2031, with full mass production readiness targeted for 2033, aimed at enabling fabrication of larger data center chips designed by companies such as NVIDIA.

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